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1111R
Surface Mount IRED/Reverse Mount Type
Features
Package Product features 3216 Reverse Mount type, Water clear epoxy Outer Dimension 3.2 x 1.6 x 1.1mm ( L x W x H ) Flat Lenz type Total Output Power DNK 8.3mW TYP. (IF=20mA) AN 2.0mW TYP. (IF=20mA) Reverse Mount type Lead-free soldering compatible RoHS compliant
Peak Wavelength
DNK AN
: 865nm : 950nm
Half Intensity Angle
DNK AN
: 155 deg. : 150 deg.
Die materials Rank grouping parameter Assembly method Soldering methods Taping and reel ESD-withstand voltage
GaAlAsDNK
GaAsAN
Sorted by radiant intensity per rank taping Auto pick & place machine (Auto Mounter) Reflow soldering Please refer to Soldering Conditions about soldering. 3,000pcs per reel in a 8mm width tape. (Standard) Reel diameter:180mm 2kV (HBM)
Recommended Applications
Car Audio, Electric Household Appliances, OA/FA, PC/Peripheral Equipment, Other General Applications
2010.03.30
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1111R
Surface Mount IRED/Reverse Mount Type
Color and Luminous Intensity
Peak Wavelength
(nm)
(Ta=25)
Part No.
Material
Lens Color
Radiant Intensity
IE ( W/sr)
TYP. DNK1111R AN1111R GaAlAs GaAs Water Clear 865 950
I F (mA) 20 20
MIN. 0.7 0.2
TYP. 1.4 0.28
I F (mA) 20 20
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1111R
Surface Mount IRED/Reverse Mount Type
Absolute Maximum Ratings
Item Power Dissipation Forward Current Pulse Forward Current Derating (Ta=25 or higher) Reverse Voltage Operating Temperature Storage Temperature
1
(Ta=25)
Absolute Maximum Ratings
Symbol Pd IF IFRM IF IFRM VR Topr Tstg
DNK 80 50 300 0.67 4.00 5 -30 +85 -40 +100
AN 75 50 300 0.67 4.00 5
Unit mW mA mA mA/ mA/ V
1 IFRM Measurement condition : Pulse Width100s, Duty1/100
Electro-Optical Characteristics
Item Conditions I F =20mA VR =5V I F =20mA I F =20mA I F =20mA I F =20mA I F =20mA I F =20mADC 5mA, -3db from 0.1MHz I F =20mA
Symbol
(Ta=25)
Characteristics DNK TYP. MAX. MAX. MIN. TYP. TYP. TYP. TYP. TYP. MIN. TYP. TYP. 1.40 1.65 100 0.7 1.4 8.3 865 45 155 50 7 AN 1.22 1.40 10 0.2 0.28 2 950 45 150 0.5 700
Unit
Forward Voltage Reverse Current Radiant Intensity Total Output Power Peak Wavelength Spectral Half-width Half Intensity Angle
VF IR IE Po p 21/2
V A mW/sr mW nm nm deg.
Cut-off Frequency Response Time
fc tr/tf
MHz ns
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1111R
Surface Mount IRED/Reverse Mount Type
Radiant Intensity Rank
(Ta=25)
IE(mW/sr) R a nk DNK IF=20mA MIN. A B C D E 0.7 1.0 1.4 2.0 2.8 MAX. 1.4 2.0 2.8 4.0 5.6 AN IF=20mA MIN. 0.20 0.28 0.40 MAX. 0.40 0.56 0.80 -
Please contact our sales staff concerning rank designation.
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1111R
Surface Mount IRED/Reverse Mount Type
Technical DataDNK
Spectral Distribution
Relative Intensity vs. Wavelength Condition : Ta = 25, IF = 20mA
Spatial Distribution Example
1.2
Condition : Ta = 25
1.0
Relative Intensity
0.8 0.6 0.4 0.2 0.0 700 800 Wavelength [nm] 900 1000
Forward Voltage vs. Forward Current
Condition : Ta = 25
Duty Ratio vs. Pulse Forward Current
Condition : Ta = 25, tw 100s
100
1000
Pulse Forward Current IFRM(mA)
Forward Current IF(mA)
10
100
1 1.2 1.3 1.4 1.5 1.6
Forward Voltage : VF(V)
10 0.001 0.01
Duty Ratio
0.1
1
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1111R
Surface Mount IRED/Reverse Mount Type
Technical DataDNK
Power Dissipation vs. Ambient Temperature
90 80
Derating
350 300
Ambient Temperature vs. Maximum Forward Curren Pulse Width tw100sec
Duty=1%
Maximum Forward Current : IF MAX. (mA)
Power Dissipation : Pd (mW)
70 60 50 40 30 20 10 0
250 200 Duty=5% 150 100 50 0 Duty=10% Duty=20% Duty=50% DC
-30
-10
10
30
50
70
90
-30
-10
10
30
50
70
90
Ambient Temperature : Ta()
Ambient Temperature : Ta()
Ambient Temperature vs. Forward Voltage
Condition : IF = 20mA
Pulse Forward Voltage vs. Pulse Forward Current
Condition : Ta=25, tw100s, Duty1/100
1.8
1000
Pulse Forward Current IFRM(mA)
1.6
Forward Voltage VF(V)
100
1.4
10
1.2
1.0 -40 -20 0 20 40 60 80 100
1 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6
Ambient Temperature : Ta ()
Pulse Forward Voltage : VFM(V)
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1111R
Surface Mount IRED/Reverse Mount Type
Technical DataDNK
Forward Current vs. Relative Total Power
Condition : Ta = 25
Forward Current vs. Relative Total Power
Condition : tw100s, Duty1/100, Ta = 25
10.0
100.0
Relative Total Power
1.0
Relative Total Power
10.0
1.0
0.1 1 10
Forward Current : IF (mA)
0.1
100
1
10
100
1000
Forward Current : IF (mA)
Ambient Temperature vs. Relative Total Power
Condition : IF = 20mA
10
Relative Total Power
1
0.1 -40 -20 0 20 40 60 80 100
Ambient Temperature : Ta ()
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1111R
Surface Mount IRED/Reverse Mount Type
Technical DataAN
Spectral Distribution
Relative Intensity vs. Wavelength Condition : Ta = 25, IF = 50mA
Spatial Distribution Example
Condition : Ta = 25
Relative Intensity
Wavelength [nm]
Forward Voltage vs. Forward Current
Condition : Ta = 25
Duty Ratio vs. Pulse Forward Current
Condition : Ta = 25, tw 100s
Forward Voltage : VF(V)
Pulse Forward Current IFRM(mA)
Forward Current IF(mA)
Duty Ratio
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1111R
Surface Mount IRED/Reverse Mount Type
Technical DataAN
Ambient Temperature vs. Forward Current
Ambient Temperature vs. Pulse Forward Current
Condition : tw100s, Duty1/100
Pulse Forward Current IFRM(mA)
Forward Current : IF (mA)
Ambient Temperature : Ta()
Ambient Temperature : Ta()
Ambient Temperature vs. Forward Voltage
Condition : IF = 50mA
Pulse Forward Voltage vs. Pulse Forward Current
Condition : Ta=25, tw100s, Duty1/100
Pulse Forward Current IFRM(mA)
Forward Voltage VF(V)
Ambient Temperature : Ta ()
Pulse Forward Voltage : VFM(V)
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1111R
Surface Mount IRED/Reverse Mount Type
Technical DataAN
Ambient Temperature vs. Peak Wavelength
Condition : IF = 50mA
Forward Current vs. Relative Total Power
Condition : - - Pulse, tw100s, Duty1/100, Ta = 25
Peak Wavelength p (nm)
Ambient Temperature : Ta()
Relative Total Power
Forward Current : IF (mA)
Ambient Temperature vs. Relative Total Power
Condition : IF = 50mA
Relative Total Power
Ambient Temperature : Ta ()
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1111R
Surface Mount IRED/Reverse Mount Type
Package Dimensions
(Unit: mm) Weight: (6.60)mg
Recommended Soldering Pattern
(Unit: mm)
Taping Specification
Quantity: 3,000pcs/ reel (standard)
(Unit: mm)
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1111R
Surface Mount IRED/Reverse Mount Type
Reflow Soldering Conditions
1) The above profile temperature gives the maximum temperature of the LED resin surface. Please set the temperature so as to avoid exceeding this range. 2) Total times of reflow soldering process shall be no more than 2 times. When the second reflow soldering process is performed, intervals between the first and second reflow should be short as possible (while allowing some time for the component to return to normal temperature after the first reflow) in order to prevent the LED from absorbing moisture. 3) Temperature fluctuation to the LED during the pre-heating process shall be minimized.
Manual Soldering Conditions
Iron tip temp. Soldering time and frequency 350 3s 1 time (MAX.) (30 W Max.) (MAX.) (MAX.)
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1111R
Surface Mount IRED/Reverse Mount Type
Reliability Testing Result
Reliability Testing Result Room Temp. Operating Life Applicable Standard EIAJ ED4701/100(101) Testing Conditions Ta = 25, IF = Maxium Rated Current (Pretreatment) Individual standard (Reflow Soldering) Pre-heating 150180 120s Operating Heating 230 Min. Peak temperature 260 Minimum Rated Storage Temperature(30min) Normal Temperature(15min) Maximum Rated Storage Temperature(30min) Normal Temperature(15min) Ta = 602, RH = 905% Ta = Maximum Rated Storage Temperature Ta = Minimum Rated Storage Temperature 98.1m/s (10G), 100 2KHz sweep for 20min., XYZ each direction
2
Duration 1,000 h
Failure 0/25
Resistance to Soldering Heat
EIAJ ED4701/300(301)
Twice
0/25
Temperature Cycling Wet High Temp. Storage Life High Temp. Storage Life Low Temp. Storage Life Vibration, Variable Frequency
EIAJ ED4701/100(105) EIAJ ED4701/100(103) EIAJ ED4701/200(201) EIAJ ED4701/200(202) EIAJ ED4701/400(403)
5 cycles
0/25
1,000 h 1,000 h 1,000 h 2h
0/25 0/25 0/25 0/10
Failure Criteria
Items
Radiant Intensity Forward Voltage Reverse Current
Symbols
IE VF IR
Conditions
IF Value of each product Radiant Intensity IF Value of each product Forward Voltage VR = Maximum Rated Reverse Voltage V
Failure criteria
Testing Min. Value Initial Value x 0.5 Testing Max. Value Spec. Max. Value x 1.2 Testing Max. Value Spec. Max. Value x 2.5
2010.12.30 2010.03.30
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1111R
Surface Mount IRED/Reverse Mount Type
Special Notice to Customers Using the Products and Technical Information Shown in This Data Sheet
1) The technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor the granting of any license. 2) For the purpose of product improvement, the specifications, characteristics and technical data described in the data sheets are subject to change without prior notice. Therefore it is recommended that the most updated specifications be used in your design. 3) When using the products described in the data sheets, please adhere to the maximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. We are not responsible for any damage which may occur if these specifications are exceeded. 4) The products that have been described to this catalog are manufactured so that they will be used for the electrical instrument of the benchmark (OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument). The application of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrong operation might influence the life or the human body. Please consult us beforehand if you plan to use our product for the usages of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. except OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument. 5) In order to export the products or technologies described in this data sheet which are under the "Foreign Exchange and Foreign Trade Control Law," it is necessary to first obtain an export permit from the Japanese government. 6) No part of this data sheet may be reprinted or reproduced without prior written permission from Stanley Electric Co., Ltd. 7) The most updated edition of this data sheet can be obtained from the address below: http://www.stanley-components.com
2010.03.30
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